The "core brain" of the charging pile, Xianfeng, is here! XinCheng Technology - with its hardcore dual-layer motherboard, sets a new paradigm for charging!

The hardcore dual-layer motherboard from XinCheng Technology serves as the "core brain" of the charging pile, featuring the following characteristics and advantages:

1. Layered structure design

• Upper and lower layer layout: The dual-layer motherboard is electrically connected and physically fixed through welded metal pillars, pin headers, or other connecting devices. This layered design enables the motherboard to achieve a more complex circuit layout within a limited space, improving space utilization.

• Circuit distribution optimization: Basic circuits such as power supply circuits and grounding lines are distributed on one layer, while control circuits, communication circuits, and circuits sensitive to signal interference are arranged on another layer to reduce mutual interference between different circuits.

2. Electronic component integration

• High-performance chips and processors: The motherboard is equipped with a high-performance main control chip, which serves as the "brain" of the charging station, responsible for controlling the charging process, monitoring the charging status, communicating with vehicles, and more.

• Basic components and relays: A large number of basic components such as capacitors, resistors, and inductors are used to achieve functions such as filtering, voltage stabilization, and current limiting in circuits. Relays are used to control the on-off state of charging circuits, meeting different current carrying capacities.

• Communication module: Integrates communication modules such as 4G module, Bluetooth module, and WiFi module to enable communication between the charging pile, vehicles, and the back-end management system.

• Rich interfaces: Equipped with multiple interfaces, it can connect to external devices such as charging guns, displays, card readers, buttons, etc., enabling functional expansion.

3. Protection and fixation measures

• Protective coating: The surface of the double-layer mainboard is coated with a protective coating, such as conformal coating, to prevent environmental factors such as dust, moisture, and corrosion, thereby enhancing the reliability and anti-interference capability of the mainboard.

• Fixed hole positions: There are multiple fixed hole positions on the motherboard, which are used to securely install the motherboard inside the charging pile chassis to prevent it from loosening or being damaged due to vibration or other reasons.

4. Heat dissipation and thermal management

• Heat dissipation design: The dual-layer structure optimizes the heat dissipation channels, making it easier for heat to dissipate. This helps improve the operational stability and reliability of the charging station, and extend its service life.

• Heat dissipation material: Add heat sinks between two layers to cope with the heat generated during the operation of the charging pile.

5. Clear functional zoning

• Functional module partitioning: It facilitates the arrangement of different functional modules on different layers, making the circuit design more organized and facilitating later maintenance and fault diagnosis.

6. Electromagnetic compatibility (EMC)

• Electromagnetic compatibility optimization: The double-layer structure helps to better control electromagnetic radiation and resist electromagnetic interference, meeting relevant electromagnetic compatibility standards.

7. Reduce wiring complexity

• Rational wiring: A dual-layer layout allows for a more rational planning of wire routing, reducing wire crossings and clutter, lowering wiring complexity, and enhancing circuit reliability.

XinCheng Technology's robust dual-layer motherboard, through these designs and features, provides powerful performance and stability for charging stations, setting a new paradigm in the charging field.